| 摘要 |
The coolant (5) is contained in a case (1) the sides of which are sealed by a pair of circuit boards (4) conveying IC chips (3) which project into the coolant. Bubble traps (8) are located above each heat exchanger (6) immersed in the liquid. If the circuit boards are instead immersed horizontally in the coolant, they may themselves act as bubble traps. The device avoids determination with time efficiency of heat exchanger disposed above coolant surface, and necessity for degassing, due to accumulation of gases other than coolant vapour. |
