Cooling device for electronic components

摘要

The cooling device especially for components has a thermally conductive element which connects an element to be cooled, preferably an electronic component, in a thermally conductive manner to an outer housing, or to a part of an outer housing. In contrast to conventional heat sinks, the heat is in this way not emitted to the interior of the housing, but is emitted directly to the exterior and the housing itself is used as cooling element. In addition to good cooling performance and low thermal stress in the interior of the housing, it is possible to use the housing interior optimally or to avoid long leads, since the components can be fitted at any desired point in the interior of a housing, as a result of the thermally conductive element which is used as fastening parts.