| 摘要 |
PURPOSE:To make it possible to lap a plurality of semiconductor wafers at once and to simplify removal of the semiconductor wafer by attaching a plurality of semiconductor wafers to a large mounting plate through a single sheet for each semiconductor wafer. CONSTITUTION:When a pattern surface of a semiconductor wafer 3 is attached to a mounting plate through a sheet and a rear of the semiconductor wafer 3 is lapped to manufacture a semiconductor device, a plurality of semiconductor wafers 3 are attached to the large mounting plate 1 through a single sheet 2 for each semiconductor wafer 3. For example, the large mounting plate 1 is heated to 115 deg.C and a plurality of sheets 2 are attached along a periphery by using electron wax. Then the semiconductor wafer 3 is attached to each sheet 2 by using electron wax, and a wrap guide 6 is attached to each sheet 2 by using electron wax. The wrap guide 6 is further attached to each sheet 2 by using electron wax. After press cooling is conducted, a rear of the semiconductor wafer 3 is lapped to a specified thickness. |
