SUBSTRATE ARRANGEMENT STRUCTURE

摘要

PURPOSE:To reduce the size of a device by arranging substrate which have reflected image reflections with each other side by side for the purpose that lead sections which should be connected to a common external connecting line are faced to each other. CONSTITUTION:Lead sections L are formed in semicircle recessed sections which are made by cutting the side of substrates 13 and conductive patterns formed on the adjacent substrates 13 are made so that they have reflected image relations with each other. Therefore, the lead sections L formed on the adjacent substrates 13 are arranged so that they have reflected image relations with each other. The substrates which have reflected image relations with each other are brought into contact with each other on the side to be arranged side by side. The semicircle recessed sections in which the lead sections L are formed are put together, making circle throughholes. By inserting a single external connecting line into this throughhole and then soldering, the external connecting line is connected to both lead sections L simultaneously.