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发明名称
DIE BONDING DEVICE
摘要
申请公布号
JPH0268938(A)
申请公布日期
1990.03.08
申请号
JP19880220924
申请日期
1988.09.02
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
SHIYUUSE WATARU
分类号
H01L21/52
主分类号
H01L21/52
代理机构
代理人
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地址
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