| 摘要 |
PURPOSE:To make a hybrid integrated circuit device thinner by externally extending the feet of lead pins in parallel with each other on the front and the back face of an insulating substrate and folding the end parts of these feet as they are able to be raised on a mother substrate. CONSTITUTION:The feet of lead pins 10 are extended externally in parallel with each other on the front and the back face of an insulating substrate 1 and the end parts of these feet 10a are folded as they are able to be raised on a mother substrate 6. Therefore the opposing distance between both the bottom face of the folded end part 10a, 10a... of each of the lead pins 10, 10... and the lower face of an electric circuit element 2 loaded on the back face of the insulating substrate 1 is made narrow so that the thickness of the entire insulating substrate 1 containing the lead pins 10, 10... may be reduced. Such thinner insulating substrate 1 is raised up on the mother substrate 6 and the raised parts are stuck thereto by the soldering process 3, whereby making the entire hybrid integrated circuit device thinner. |
