发明名称 |
PHYSICAL VAPOR DEPOSITION DUAL COATING APPARATUS AND PROCESS |
摘要 |
A machine for covering a substrate (Fig. 14, 540) by means of both cathodic are plasma deposition (CAPD) (Fig. 2) and magnetron sputtering (Fig. 1) without breaking vacuum in a single chamber (Fig. 14, 421). A computer system monitors (Fig. 3, 403, 405) and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table (Fig. 14, 470) used in conjunction with internal and external targets coats both sides of the substrate simultaneously. |
申请公布号 |
WO9002216(A1) |
申请公布日期 |
1990.03.08 |
申请号 |
WO1988US02950 |
申请日期 |
1988.08.25 |
申请人 |
VAC-TEC SYSTEMS, INC. |
发明人 |
RANDHAWA, HARBHAJAN, S.;BUSKE, JEFFREY, M. |
分类号 |
C23C14/22;C23C14/32;C23C14/34;C23C14/35;C23C14/50;C23C14/52;C23C14/54;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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