| 摘要 |
PURPOSE:To prevent heat from dissipating from a lead frame by heating from below the connecting range of the frame and heating from both side edges of a whole frame by providing a heat block for thermally placing the frame from below, and a guide for holding the both side edges of the frame in a heat source. CONSTITUTION:When a lead frame 1 is introduced into the frame feeder 4 of a wire bonding apparatus, it is heated from a guide 13, and the frame 1 itself is heated. It is introduced onto a heater block 8 before a bonding unit in this state, heated from its downward direction to be thermally balanced at a predetermined temperature. The frame 1 itself is expanded in this state, and secured at the bonded part by a frame retainer 9 and the block 8. Heat is supplied from the guide 13 in this state to prevent the heat dissipation of a semiconductor pellet 11 to its minimum limit, thereby suppressing the displacement of the position of the point to be bonded of inner leads to its minimum limit. |
