发明名称 |
PROCESS FOR MAKING ELECTRICAL-CIRCUIT BOARDS |
摘要 |
Circuit boards with conductor tracks having good adhesion are obtained by chemically or mechanically removing the cladding from the substrate boards which are clad with copper foil on both sides, activating and, optionally, sensitising them, providing them with a 0.05-2.0 mu m thick layer composed of nickel, cobalt, manganese, or a nickel/iron or nickel/cobalt mixture in an electroless metallisation bath, applying a 0.5-5.0 mu m thick copper layer in a subsequent copper bath and building up the conductor pattern thereon by standard semi-additive methods. |
申请公布号 |
EP0324189(A3) |
申请公布日期 |
1990.03.07 |
申请号 |
EP19880121921 |
申请日期 |
1988.12.31 |
申请人 |
BAYER AG |
发明人 |
WOLF, GERHARD DIETER, DR.;SIRINYAN, KIRKOR, DR.;VON GIZYCKI, ULRICH, DR.;MERTEN, RUDOLF, DR.;LANGER, FRIEDRICH |
分类号 |
H05K3/24;C23C2/02;H05K3/10;H05K3/18;H05K3/38;H05K3/42;(IPC1-7):H05K3/38 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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