| 摘要 |
PURPOSE:To obtain a high density hybrid integrated circuit which is printed with solder cream and on which a chip part is mounted by forming a planar lead frame wherein a resin is sealed in the gap part of the lead frame which is punched with a metal mold. CONSTITUTION:A sheet of iron-nickel alloy plate is punched with a metal mold having a specified shape and the like, and a lead frame 1 is obtained. An epoxy resin is injected in the inside of a lead frame tie bar part 1' of a gap part 2 of the lead frame 1 by an injection molding method. Thus a resin-filled region 3 is provided in the lead frame 1. The resin filled region 3 has the same thickness as that of the lead frame 1 and forms a plane. Solder cream 4 is printed on a chip attaching part of the lead frame 1 having the planar shape. A chip ceramic capacitor 5 is mounted. Temperature is increased, and solder bonding is performed. Flux component is cleaned and removed by using organic solvent. A semiconductor element 6 such as an IC is bonded with an epoxy resin 7 for die bonding. Then, bonding junctions are provided for terminal parts of the circuit on the lead frame through gold wires 8. A silicon resin 9 for junction coating is applied, and the circuit is constituted on the lead frame 1.
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