| 摘要 |
An electrical circuit interconnect system employs an electrically conductive enclosure (57) and cover (64) which completely encompasses, hermetically seals (54) and electrically isolates from the outside environment a component (18) mounted on first surface of an insulating substrate (16) of a microwave circiut (56). A plurality of conductors (12) mounted on the first surface of the insulating substrate (16) electrically connect the component (18) to the outside electrical circuitry by passing under a corresponding plurality of pass-through bores (58) within the base of the enclosure (57). Specifically, within each respective passthrough bore (58), a corresponding glass encased conductor (60 and 62) electrically connects each conductor (12) within the enclosure to a conductor outside of the enclosure (57). A plurality of conductor paths (66) extend through bores in the insulating substrate (16) to electrically connect the enclosure (57) to a circuit ground plane (14) located on a second surface, opposite to the first surface, of the insulating substrate (16 ).
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