发明名称 |
Method of making a hermetically sealed electronic component |
摘要 |
A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts. |
申请公布号 |
US4906311(A) |
申请公布日期 |
1990.03.06 |
申请号 |
US19880172014 |
申请日期 |
1988.03.23 |
申请人 |
JOHN FLUKE CO., INC. |
发明人 |
GUROL, I. MACIT |
分类号 |
H01C13/02;H01C17/242;H01L23/29;H01L23/31;H05K1/03;H05K1/16 |
主分类号 |
H01C13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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