| 摘要 |
A photoresist film is coated on semiconductor wafer by dispense method and then a solvent of photoresist is sprayed on the wafer. The photoresist is dispensed from a nozzle in the range of 20o -80o slope to the surface of wafer. The nozzle is directed to the center of wafer and the tip of the nozzle is positioned perpendicular to the circumference of wafer, while forming the slope of 20o-80o to the surface. Also, the nozzle can be modified in the range of 20o-80o slope to achieve the dispensing angle. The photoresist film can be uniformly coated while preventing the phenomenon of speed boat.
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