| 摘要 |
The machine has two wafer supports arranged so that one wafer can be cut whilst other wafer is being aligned for cutting. The cutting station (2) is disposed centrally of two alignment stations (4A,4B). For transforring wafers between the stations and through the machine, a transfer device (6) has two moving frames (14a, 14B) on support rails (12). A respective subsidiary movable frame (30A, 30B) and support rails (32A) mount a wafer support (50A, 50B) on which a respective semiconductor wafer (W) is disposed fach wafer is formed with cutting lines which are detected by a respective optical microscope (86, 86B) at the alignment stations. The detectors guide rotation of the wafer supports brings the wafer into a required orientation for cutting by th blades (158A, B).
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