| 摘要 |
<p>PURPOSE:To alleviate the restrictions placed on the determination of the case size of a multi- pin semiconductor due to the standpoint of a manufacture side such as the mounting of components, to make the case small in size, and to improve a substrate in packaging density by a method wherein contact pads provided on the wiring substrate corresponding to outer lead terminals are arranged in a staggered pattern. CONSTITUTION:An outer lead terminal 4 is composed of an extension 4a extended from an inner lead and a tip 4b which is formed by bending the extension 4a into a crank shape and level with the contact pad 5 on a wiring substrate when a semiconductor case is packaged. The lengths of the extensions 4a of these outer lead terminals 4 or the positions where the tips 4b connected to the contact pads 5 extend are different from each other at intervals of a lead terminal. The contact pads 5 are arranged in a staggered pattern on the wiring substrate corresponding to the positions of the tip 4b of the lead terminals 4, and the pads 5 are connected to the outer lead terminals 4 with, for instance, solder or the like. And, the lengths of the lead terminals 4 are varied at intervals of a lead terminal and the connecting positions of the lead terminals 4 with the pads 5 are different from each other, whereby a required lead pitch can be ensured and the packaging density of a semiconductor case can be improve even if a case body is made small in size or pins are increased in numbers.</p> |
