发明名称 SILVER ALLOY SOLDER FOR BONDING CERAMIC MEMBERS MUTUALLY OR DIRECTLY BONDING CERAMIC MEMBER TO METAL MEMBER
摘要 <p>Solders for directly soldering together ceramic parts consisting essentially of 70 to 99% silver, 0.5 to 15% by weight indium or 0.5 to 10% by weight tin and 0.5 to 15% by weight titanium or zirconium, or mixtures thereof. These solders are very ductile, are workable at comparatively low temperatures and provide very firm bonding.</p>
申请公布号 JPH0264069(A) 申请公布日期 1990.03.05
申请号 JP19890174296 申请日期 1989.07.07
申请人 DEGUSSA AG 发明人 BUIRI MARIKOFUSUKII;BUORUFUGANGU BUAIZE
分类号 B23K35/30;C04B37/00;C04B37/02;C22C5/06 主分类号 B23K35/30
代理机构 代理人
主权项
地址