| 摘要 |
<p>PURPOSE:To prevent generation of flaws and chips at divided pellets by forming one hand of scribe grooves in X and Y directions deeper than the other hand, and shifting a roller in the direction of shallow grooves and next shifting it in the direction of deeper grooves. CONSTITUTION:Grooves 4 in the X direction are cut in about half the thickness of a wafer 1 with a saw 5. Next, grooves 6 in the Y direction are cut deeper than the grooves 4 with the saw 5. When the wafer 1 is turned out together with a adhesive sheet 2 on a protective sheet 7 and a roller 6 is put on the sheet 2 and is shifted in parallel with the groove, only the deep grooves 6 crack, and an Si layer hardly brings about it. Next, when the roller 6 is shifted along the grooves 4, the shallow grooves 4 crack, and the Si layer hardly brings about it.</p> |
