| 摘要 |
PURPOSE:To reduce a warp, of a package, to be caused by a change in a temperature by a method wherein a shape of a part connected electrically to the rear of a semiconductor element is formed to be a metal thin wire shape or a metal foil shape. CONSTITUTION:When the rear of a semiconductor element 3 and one part of a lead 7b on the surface of a carrier tape are connected electrically by using a metal thin wire or a metal foil 13 and are sealed by a transfer molding method, also the rear of the semiconductor element 3 is sealed and a symmetrical property in upward and downward directions of a package is kept; thereby, a semiconductor package whose warp caused by a change in a temperature is small is obtained. When this package is compared with a conventional package where also the rear of a cap is sealed in order to reduce a warp of the package, an effect of a displacement of the symmetrical property of the semiconductor package formed of a material which is used to connect the rear of the semiconductor to one part of the lead on the surface of the tape carrier is small because a strength (a bending strength) of said material is small;; accordingly, the warp is reduced as compared with the conventional package. |
