| 摘要 |
<p>PURPOSE:To assure a hole size and a position of a hole with high accuracy in a desired manner by forming the hole through a first insulator layer formed on the main surface of a metal substrate by making use of laser processing or drilling. CONSTITUTION:A copper foil is selectively etched to form a desired first circuit pattern, and a hole of the diameter of 50mum for example is formed through a first insulator layer at a given location or region using a laser. The drilling is performed to selectively expose the surface of an A1 plate, and in the laser processing a YAG laser with a 0.35mm spot size is employed for irradiation of 50W in power for 1.0sec. Herein, the formation of the hole through the first insulator layer may be performed by drilling. For example, a 0.55mm diameter hole is formed through an about 50mum thick insulator layer, a 0.45mm diameter drill is used at the rotational speed of 700rpm.</p> |
