| 摘要 |
PURPOSE:To restrain a dust particle from being produced inside an apparatus as far as possible, to reduce a defective product and to enhance a yield by a method wherein the surface of individual wafer-carrier loading stages installed at wafers is coated with a resin. CONSTITUTION:At least the surface of individual wafer-carrier loading stages 10, 40, 70 of a sender 1, a buffer 4 and a receiver 7 is coated with a resin such as a fluroresin, polyamide, polyimide or the like whose heat resistance, shock resistance, wear resistance and the like are excellent. A wafer is taken out by a conveyance mechanism 11 from a wafer carrier of the sender 1; it is treated one after another by a dehydration baking operation, a cooling operation, a resist coating operation and a prebaking operation; it is housed inside a wafer carrier of the receiver 7. During these operations, it is treated in a high dust-free state. |
