发明名称 RESIST APPLYING DEVICE
摘要 PURPOSE:To improve the processing capacity of a line and to speed up operation on the whole device by coupling coaters which are long in processing time in series. CONSTITUTION:The water 6 of the lowermost stage is taken out of a carrier 7 by a sender 1, a coater 2A is passed placed on the chuck 21 of a coater 2B, and a 2nd wafer 6 is put on the chuck 21 of the coater 2A. The wafer 6 of the coater 2B is conveyed to heat plates 3C and 3D after resist is applied. Simultaneously, the wafer 6 of the coater 2A passes the coater 2B and is conveyed onto a heat plate 3C, and an unprocessed wafer 6 is conveyed by the send or 1 to two coaters 2 in order similarly. The wafer 6 after being heated by a heat plate D is received by a receiver 4. The wafer on the heat plate 3C is carried by a moving beam 31. Thus, coaters 2 are coated with resist and calcined by heat plates 3 in order. The coaters which are long processing time are coupled in series, so the processing capacity of the line is high.
申请公布号 JPH0262547(A) 申请公布日期 1990.03.02
申请号 JP19880214099 申请日期 1988.08.29
申请人 TOKYO ELECTRON LTD 发明人 HIRASAWA MASAKATSU
分类号 G03F7/16;H01L21/027;H01L21/30;H01L21/31 主分类号 G03F7/16
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