| 摘要 |
<p>PURPOSE:To easily assemble a semiconductor element of accurate circuit constitution by positioning a magnet body and lead parts when a resin base body is molded by injection and performing integral molding. CONSTITUTION:A semiconductor element 2, the lead parts 4, 5..., and the magnet body 3 are positioned in the cavity space 10a of metallic molds 10 and 11. Then when the metallic molds 10 and 11 are clamped, projection sides 4a, 5a... of the lead parts 4, 5, which are bent in specific shapes are positioned outside the space 10a as wire bonding terminal surface for the element 2. Then the resin base body 1 wherein the axes of the lead parts 4, 5... and magnet body 3 are held is molded integrally of resin injected into the space 10a. After the molds are detached, the element 2 is fitted and fixed by the recessed part 1b of the base body 1 and the element 2 and the wire bonding terminal surfaces of the lead parts 4, 5... are connected electrically to assemble the magnetic sensor.</p> |
