| 摘要 |
PURPOSE:To reduce the number of through-holes by providing a plurality of conductor paths insulated electrically from each other on one through-hole and connecting pairs of conductive path patterns separately with the aid of the plurality of the conductive paths. CONSTITUTION:An insulating layer 1 electrically insulates respective conductive circuit pattern layers 2a, 2b, 2c, 2d and so on which are then united to construct a multi-layered printed wiring board. Moreover, a through-hole 3 formed in a given region of the multilayered printed wiring board are provided at locations or regions where the paired conductive circuit patterns, e.g., 2a and 2b, 2c and 2d can be electrically conducted. Additionally, each conductive path 4a or 4b formed integrally on the inner wall of the through-hole 3 and electrically insulated from each other share, not exclusively, the through-hole 3. The conductive paths 4a, 4b isolated from each other can be formed in formation of a through-hole conductive layer utilizing chemical plating by selectively depositing thereon a desired plating layer after depositing a plating resist on unnecessary portions thereof. |
