发明名称 DEVELOPING METHOD
摘要 PURPOSE:To improve the uniformity of development and to eliminate deterioration in shape by processing a surface with a liquid developer of low concentration, and drying the surface and performing development with a liquid developer of high concentration. CONSTITUTION:Pure water 4 is supplied from a pure water nozzle 2a to the processed surface 1a of a wafer as a body 1 to be developed and the liquid developer 6 is supplied from a liquid developer spray 2b to the processed surface 1a. Then the liquid developer is sprayed over the entire processed surface 1a under high pressure. The surface is dried by shaking the liquid off the body to be processed by the rotation of a table 3 and the liquid developer 7 is supplied to the processed surface 1a by using another liquid developer nozzle 2c, where this liquid developer 7 is thicker than the developer diluted with the pure water. Then the body 1 is left as it is while the liquid is held in a swelling state to advance the development. Consequently, the uniformity of the development is good and the shape of the resist is excellent.
申请公布号 JPH0263060(A) 申请公布日期 1990.03.02
申请号 JP19880216049 申请日期 1988.08.30
申请人 SONY CORP 发明人 IKEDA RIKIO
分类号 G03F7/30;H01L21/027 主分类号 G03F7/30
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