发明名称 HYBRID INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To ensure the connection of a conductive coating with a grounding lead by a method wherein a grounding lead is composed of a grounding outer lead and a grounding intermediate connection lead electrically connected therewith, and the grounding intermediate connection lead is coated with the conductive coating. CONSTITUTION:A grounding lead 3 is fixed to a circuit substrate 1, an insulating outer coating 4 is formed, them an grounding intermediate connection lead 3b is bent in a reverse direction by applying force to such a extent that a part of the lead 3b is brought into contact with the insulating outer coating 4, and a conductive coating 5 is formed using a conductive paint or a conductive resin. In this process, the conductive coating 5 is formed in such a manner that it covers a part of the grounding intermediate connection lead 3b and ensures the electric insulation preventing it from touching other leads which extend from the circuit board 1. Therefore, the insulating outer coating 4 near various kinds of leads is not coated with the conductive coating 5 and exposed, so that the conductive coating 5 is electrically connected with only the grounding intermediate connection lead 3b and the electrical insulation between the conductive coating 5 and other various kinds of leads can be retained.</p>
申请公布号 JPH0260196(A) 申请公布日期 1990.02.28
申请号 JP19880212134 申请日期 1988.08.26
申请人 ORIGIN ELECTRIC CO LTD 发明人 KIKUCHI TADAO;SATO MINORU
分类号 H01R4/64;H05K3/46 主分类号 H01R4/64
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