发明名称 |
PRODUCTION OF COPPER-CLAD DIELECTRIC BOARDS |
摘要 |
PCT No. PCT/GB84/00441 Sec. 371 Date Oct. 21, 1985 Sec. 102(e) Date Oct. 21, 1985 PCT Filed Dec. 19, 1984 PCT Pub. No. WO85/02969 PCT Pub. Date Jul. 4, 1985.Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used. |
申请公布号 |
EP0198835(B1) |
申请公布日期 |
1990.02.28 |
申请号 |
EP19850900481 |
申请日期 |
1984.12.19 |
申请人 |
M & T LAMINATES LIMITED |
发明人 |
THORPE, JOHN, EDWIN;SARANG, GURSHARAN, SINGH |
分类号 |
B29C70/06;B29C43/20;B29K105/06;B29K105/22;B29L31/34;B32B7/02;B32B9/00;B32B15/08;B32B37/00;B32B37/10;B44C1/14;B44C1/16;H05K3/02;H05K3/38 |
主分类号 |
B29C70/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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