| 摘要 |
<p>A solid state image pickup device comprises: a transparent support (101); one or more transparent substrate chips (102) mounted on the support; one or more photoelectric converting elements (103) formed on the transparent substrate chips; a fixing agent (107) for fixing the transparent substrate chips, at the face opposite to the face on which the photoelectric converting elements are formed, to the support at one end thereof; and an anti-reflection mold (105) for covering the transparent substrate chips on at least the sides thereof, the refractive index of the anti-reflection mold being equal to or larger than that of the transparent substrate chips. Such an arrangement can provide a wide-area type solid state image pickup device, particularly a solid state image pickup device of the in-line type in which element chips are arranged in a line, which is equal in optical and electrical continuity to a single-line solid state image pickup device, and which is of high precision, high reliability, easy to use, of low costs, and compact in structure.</p> |
