发明名称 PACKAGE STRUCTURE
摘要 PURPOSE:To prevent cracks from occurring in a substrate by a method wherein the ceramic substrate is fixed by a frame provided with a peak and a clamp through the intermediary of spacers. CONSTITUTION:A ceramic substrate 2 is placed on a frame 5 through the intermediary of a first spacer 4, a second spacer 6 is placed on thereon, and the substrate 2 and the frame 5 are fixed to each other through a screw 8. Then, the clamp 7 presses the second spacer 6, the substrate 2, and the first spacer 4 against the frame 5, and a section A of the first spacer 4 serves as a stopper in a lateral direction to fix the substrate 2, and the first and the second spacers 4 and 6 are formed of resin which is easy to deform, so that the warpage of the frame 5 and the substrate 2 and the stress of press caused by the clamp 7 and the screw 8 can be absorbed by these spacers and consequently cracks can be prevented from occurring in the substrate 2.
申请公布号 JPH0260197(A) 申请公布日期 1990.02.28
申请号 JP19880211661 申请日期 1988.08.26
申请人 NEC CORP 发明人 YAMAGUCHI YUKIO
分类号 B65D85/86;B65D85/38;H01L23/00;H01L25/04;H01L25/18;H05K7/14 主分类号 B65D85/86
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