| 摘要 |
<p>PCT No. PCT/DE87/00218 Sec. 371 Date Dec. 7, 1988 Sec. 102(e) Date Dec. 7, 1988 PCT Filed May 9, 1987 PCT Pub. No. WO88/00396 PCT Pub. Date Jan. 14, 1988.A multiple-plate hybrid device with integrated heat dissipation for thick-film hybrid substrates containing hybrid circuits in which the thick-film hybrid substrates are inserted in metal frames of a metal housing and at least partially coupled with portions of the metal frames for dissipating the occurring heat.</p> |
