| 摘要 |
PURPOSE:To obtain the equipment capable of fixing a loading point at a time when a semiconductor substrate is peeled from a glass plate and the glass plate and enabling the equalizing of temperature difference before and after peeling and avoiding a direct contact by tweezers with a wafer after peeling by mounting rspectively specific soaking section, a pushing jig, a guide strut and a temperatue control section. CONSTITUTION:A production equipment 30 for a semiconductor device peeling a semiconductor substrate 1 bonded with a plate 2 for holding by wax 10 from the plate 2 for holding has a recessed section, which has a heater 14 and on a top face of which a work 11 composed of the semiconductor substrate 1, the plate 2 for holding and the wax 10 is housed, a soaking section 12 to which a recessed section housing a mesh holder 13 receiving the semiconducotor substrate 1 is formed so that the semiconductor substrate 1 is not brought into contact when the substrate 1 is moved from the upper section of the surface of the plate 2 for holding, a pushing jig 17 applying loading onto the surface of the plate 12 for holding of the work 11 being soaked by the heater 14, a guide strut 18 sliding the pushing jig 17, shifting the semiconductor substrate 1 and housing the mesh holder 13, and a temperature control section 16 controlling the temperature of the soaking section 12.
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