发明名称 |
Suction device |
摘要 |
Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.
|
申请公布号 |
US4904012(A) |
申请公布日期 |
1990.02.27 |
申请号 |
US19890293614 |
申请日期 |
1989.01.05 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NISHIGUCHI, MASANORI;SEKIGUCHI, TAKESHI |
分类号 |
B25B11/00;H01L21/677;H01L21/68;H01L21/683;(IPC1-7):B25J15/06 |
主分类号 |
B25B11/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|