发明名称 |
Slicing machine for cutting semiconductor material |
摘要 |
Slicing machine having a handle to be driven manually to generate command pulses. By revolving the handle, a feedtable is moved at the operator's command, enabling the positioning of a semiconductor material at the right position to start slicing. The thickness of the first wafer cut off from the material as well as other wafers, has a predetermined thickness, so that no wafer is wasted.
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申请公布号 |
US4903437(A) |
申请公布日期 |
1990.02.27 |
申请号 |
US19880223798 |
申请日期 |
1988.07.25 |
申请人 |
MITSUBISHI KINZOKU KABUSHIKI KAISHA |
发明人 |
KUBOTERA, YUTAKA;AKIYAMA, KAZUNARI |
分类号 |
B28D5/02;G05B19/23 |
主分类号 |
B28D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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