| 摘要 |
PURPOSE:To mount electronic components high in density by electrically connecting a conductor circuit in a stepped opening to the components, and connecting a part of the circuit to inner leads via a through hole. CONSTITUTION:A conductor circuit 4 formed on a base 6 is formed in a multilayer structure, the circuit of first and second layers is stepwisely externally exposed, and an electronic component 2 is connected to the circuit 4, after the component 2 is placed, via fine metal wirings 3. The component 2 is sealed with potting resin 1. Inner leads 5 is buried in the base 6, and electrically connected to the circuit 4 of predetermined layer via a through hole 8. Leads 7 integral with the leads 5 protrude externally of the base 6.
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