HEAT SINK

摘要

Low thermal resistance coupling is provided between electronic components and a main heat sink by the expedient of providing individual, adjustable height pillars between them. Each pillar comprises a bifurcated body and a detachable head. The head is attached to the hot component by means of silver loaded epoxy. The height of the pillar may subsequently be adjusted, the component attached to a circuit board, and the pillar secured by establishing an interference fit between the pillar and the walls of its mounting hole. Thermal resistances of less than 6.5.degree.C/Watt are achieved between a semiconductor junction and a heat sink coupled in this way.