| 摘要 |
A selective electroplating apparatus includes a flexible conveyor belt for receiving contact pins, one portion of each contact pin extending from one side of the conveyor belt and a second portion extending from the opposite side of the conveyor belt. A reel constrains the travel of the conveyor belt into a loop which is defined by a substantially vertical plane, the web of the conveyor belt being oriented in a substantially horizontal alignment and the loop having upper and lower elongated regions. By this structure, the reel causes one portion of the contact pins to be oriented downwardly from the belt in the upper elongated region and another portion of the contact pins to be oriented downwardly from the belt in the lower elongated region. At least one plating tank is provided adjacent the upper elongated region for contacting the downwardly extending portions of the contact pins and another plating tank is provided adjacent the lower elongated region for contacting the downwardly extending portions of the contact pins.
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