PROCESS FOR PRODUCING COPPOR THROUGH - HOLE PRINTED CIRCUIT BOARD

摘要

(a) forming pattern onto copper-plated/ integrated board with resist ink(soluble in alkali aq. soln.); (b) soaking the board into aq. soln. of alkylimidazole cpd. of formula (I) for 1 min at 30-50 deg. C to form etching-resist-film, the copper surface of the board being coated with alkylimidazole cpd.; and (c) drying and treating with alkali etching soln.. In (I), R2=C5-21 alkyl; R4=H or Me; HA=derived gp. or mineral acid.