| 摘要 |
PURPOSE:To eliminate the limitation of the selection of the material of a support substrate by baking a sintering conductor forming agent formed to a circuit pattern shape together with a temporary substrate, leaving only a frame-shaped or netted conductor circuit skeleton according to a circuit pattern and unifying the skeleton with the support substrate. CONSTITUTION:A sintering conductor forming agent 20 is applied onto the surface of a temporary substrate 10 composed of an organic material, and positions corresponding to conductor circuit patterns in the surface of the sintering conductor forming agent 20 are coated with masking layers 30. The sintering conductor forming agents 20 at locations not coated with the masking layers 30 are removed, and the conductor circuit patterns by the sintering conductor forming agents 20 are formed. The sintering conductor forming agents 20 are baked together with the temporary substrate 10, thus sintering conductor components in the sintering conductor forming agents 20 while burning the temporary substrate 10, then acquiring a conductor circuit skeleton 21. A support substrate 40 is unified with the conductor circuit skeleton 21. Accordingly, the material of the support substrate 40 can freely be selected and used. |
