SEALING OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To contrive the improvement of damp-proof reliability and heat cycle resistance by using acid anhydride hardening liquid epoxy resin composition containing acid anhydride hardening agent for sealing between a semiconductor element and a base and applying amine hardening epoxy resin composition containing amine compound hardening agent and synthetic rubber-like substance for sealing for covering whole the semiconductor device. CONSTITUTION:Filling is performed between a board 1 and a semiconductor element 2 joined with a cable way at the side of the board 1 through many bumps 3 and different composition epoxy resin composition is used in resin B for sealing whole the semiconductor element 2 except for resin A for sealing and a part sealed by the resin A. In other words, acid anhydride hardening liquid epoxy resin composition is used for the resin A and amine hardening epoxy resin composition containing amine compound hardening agent and synthetic rubber-like substance is used for the resin B. Thereby high damp-proof reliability and heat cycle resistance can be realized.