发明名称 MANUFACTURE OF MULTI-LAYER PRINTED-CIRCUIT BOARD WITH BLIND THROUGH HOLE
摘要 PURPOSE:To prevent flow of a resin and reduce production cost by adhering an insulation film to the surface of an intermediate layer side of a surface layer where a blind through hole is formed and joining the film, the intermediate layer and a lower layer with a prepreg. CONSTITUTION:A laminated film wound in a roll is pulled out of a roll 43, a polyorefin film 41 is liberated, a dry solder resist film 32 is subject to contact bonding to a surface 35 of a surface layer main unit 31 by crimp rollers 45 and 46 along with a polyester film 40. After this, ultraviolet rays is irradiated for hardening the film 32 and the film 40 is peeled off and is heated to 150 deg.C. Then, a film adhered surface layer 33, intermediate layers 51 and 52, and a lower surface 53 are heated to approximately 170 deg.C and are subject to contact bonding through prepregs 54, 55, and 56. It prevents the prepregs from flowing to an upper surface 37.
申请公布号 JPH0254994(A) 申请公布日期 1990.02.23
申请号 JP19880204646 申请日期 1988.08.19
申请人 FUJITSU LTD 发明人 ISOZUKA HIROSHI
分类号 H05K3/46 主分类号 H05K3/46
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