| 摘要 |
PURPOSE:To prevent false setting of bonding position to an adjoining pad or a lead when changing a standard value to a correction value in a setting method of a bonding position by requiring correction again in case of an excessive moving width. CONSTITUTION:A pad 3 in a pad 12 provided to a chip 11 and 4 in a lead 13 are connected by wire bonding. A bonding position on the lead 4 is indicated in a picture display and an operator operates a ball chaser to move a display mark of a bonding position. If a difference Dx between an x-coordinate of a bonding point specified by the operator and an x-coordinate of a standard point exceeds an allowable moving distance dx, selecting of a lead in considered to be false and reinput of a correction value is required. |
