| 摘要 |
<p>A high capacitance flexible dielectric sheet material (10) is comprised of a monolayer of multilayer or single layer high dielectric (e.g. ceramic) chips or pellets (12) of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips (12) are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive (14) to define a cohesive sheet with the polymer (14) binding the array of high dielectric (e.g. ceramic) chips (12) together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces (28 and 30). The end result is a relatively flexible high capacitance dielectric film or sheet material (10) which is drillable, platable, printable, etchable, laminable and reliable.</p> |
