| 摘要 |
<p>PURPOSE:To prevent a dust particle from adhering to treated substrates by a method wherein a retention tool for treated substrate housing use is installed and the treated substrates unloaded from a substrate treatment part are housed one after another from an upper stage in the retention tool. CONSTITUTION:A wafer cassette 17a is situated in advance in a high position by using a water-cassette elevator 15a; semiconductor wafers 20 inside the cassette 17a are taken out from a wafer in a low step by using a conveyance mechanism 13a. The elevator 15a lowers the cassette 17a by one step whenever the wafer 20 is taken out. Then, the wafer 20 which has been taken out is delivered to an alignment mechanism 14 and is positioned; it is loaded inside a spare vacuum chamber 12b by using a conveyance mechanism 13b. After the conveyance mechanism 13a has delivered the wafer 20 to the alignment mechanism 14, it takes out a next water 20 or houses the wafer 20 which has been treated. Since other waters 20 do not exist under the wafer 20 which is always taken out and in, it is possible to prevent a dust particle from falling and adhering to the semiconductor wafers 20.</p> |
