| 摘要 |
PURPOSE:To execute a wire bonding operation stably by a method wherein the surface of a conductor is plasma-etched, a glass matter precipitated on the surface of the conductor is removed and, after that, the wire bonding operation is executed in order to expose the clean surface of a metal particle. CONSTITUTION:The surface of a substrate is coated with a thick-film conductor paste; this assembly is baked; a thick-film conductor 2 composed of metal particles 3 and a glass matter 4 is formed. Fluorine free atoms 6 generated from a fluorocarbon reacts with a glass matter 4a precipitated on the surface of the conductor 2; the glass matter 4a precipitated on the surface of the conductor 2 is transformed into SiF4 7 and O2 8; these are removed from the surface of the metal particles 3. Then, a wire bonding operation by an ultrasonic thermal pressure-bonding method is applied, and a wire is connected. Accordingly, since the glass matter precipitated on the surface of the thick-film conductor to be wire-bonded is removed, the metal particles of the thick-film conductor are brought into sufficient contact with the wire; the wire bonding operation is stabilized. |
