ASSEMBLING METHOD FOR SEMICONDUCTOR DEVICE,申请号JP19880202352-传众专利搜索

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发明名称	ASSEMBLING METHOD FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0251242(A)	申请公布日期	1990.02.21
申请号	JP19880202352	申请日期	1988.08.12
申请人	SHARP CORP	发明人	ONISHI TETSUYA;HASHIMOTO KAZUHIKO;WAKAMOTO FUSHINOBU
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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