ELECTRONIC CIRCUIT APPARATUS OF AUTOMOBILE

摘要

An electronic circuits (11, 12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the peripheral edge portion of the metal base. A step portion is formed to the metal base next to the projected portion of the metal base. A groove (28) is formed along all the peripheral portion of the bottom surface of the mold resin case. The projected portion is engaged to the groove which is filled with a bonding material (33). The bottom surface of the step portion is also covered by the bonding material when the projected portion is thrust into the groove of the mold resin case.