| 摘要 |
<p>PURPOSE:To prevent deformation, damage at the time of delivery in an aging step and to improve reliability by placing an IC chip on a tray made of mixture of heat resistant synthetic resin, inorganic filler and conductive powder, and drying the chip at a high temperature. CONSTITUTION:As heat resistant synthetic resin, synthetic resin in which expansion, contraction, deformation do not occur under the conditions of at least 130 deg.C and 20 hours is employed. Inorganic filler in which the dimensional stability (low shrinkage) of obtained tray, rigidity, mechanical strength are improved is employed. Conductive powder imparts conductivity to the obtained tray and is used to prevent the tray from being charged. The heat resistant synthetic resin, the inorganic filler and the conductive powder are mixed, and molded in a predetermined shaped to obtain the tray. An IC chip is placed on the thus obtained tray, i.e., the tray for the IC chip, and dried in an atmosphere at a high temperature. Thus, moisture contained in the chip is removed to prevent an IC from malfunctioning in its operation.</p> |
