| 摘要 |
PURPOSE:To uniformly process semiconductor substrates and to reduce the amount of used chemicals by providing rotary mechanisms which rotate the semiconductor substrates stood in a dipping tank. CONSTITUTION:The rotary mechanisms 4 and 5 which rotate the fed semiconductor substrates are provided on the bottom part of the dip ping tank 3 where the semiconductor substrates 1 are put. The semiconductor substrate storage box 2 which contains the semiconductor substrates 1 is put in the dipping tank 3 and then the fed semiconductor substrates 1 are supported by a rotary roller 4 and become loose from the semiconductor substrate storage box 2. When development processing is carried out, the rotary roller 4 is driven for a constant so that the semiconductor substrates are dipped in a liquid developer entirely; and the liquid is discharged from a liquid draining port 8. Consequently, the developer is distributed uniformly over the entire surfaces, the need for entirety dipping is eliminated, and the processing is performed with the minimum amount of liquid developer. |
