| 摘要 |
PURPOSE:To enhance the loading accuracy and humidity resistance of an LED array chip by loading a transparent glass plate with the LED array chip by a flip chip system and filling the gap between the LED array chip and the glass plate with a transparent resin. CONSTITUTION:After solder bumps 12 are formed on the electrode pad of an LED array chip 3 and a driver IC chip 5, the solder bumps 12 are positioned on a glass plate 11 by a face-down system and, for example, in the case of eutectic solder, said solder bumps are heated to about 210 deg.C to be melted to make it possible to realize a printing head. Next, a transparent resin 13, for example, a silicone resin is dripped on the periphery of the LED array chip 3 and the driver IC chip 5 to fill the gaps between the LED array chip 3, the driver IC chip 5 and the glass plate 11 according to a vacuum impregnation system. Since the solder bumps 12 can be precisely prepared, the gap between the LED array chip 3 and the glass plate 11 can be uniformized without irregularity. Therefore, the difference of the thickness of the resin to be allowed to fill between the LED array chips is extremely small and a uniform thickness is obtained. |
