发明名称 Process and apparatus for manufacturing metallized films for electric capacitors and products thus obtained
摘要 PCT No. PCT/IT87/00076 Sec. 371 Date Mar. 24, 1989 Sec. 102(e) Date Mar. 24, 1989 PCT Filed Jul. 31, 1987 PCT Pub. No. WO88/00984 PCT Pub. Date Feb. 11, 1988.The formation of three layers of overlapped metals having different thicknesses is provided on a dielectric film, these layers being a very thin layer of silver, copper or their alloys, a second zinc layer provided with a reinforcement and a third layer of aluminium or aluminium alloy comprising a percentage of titanium, silicon or cadmium lower than 1%. The layers are obtained by depositing metal vapours in a chamber at a pressure of about 10-4 torr. The apparatus comprises a vacuum chamber (10) divided in two sections (11 and 12), section (11) being a film's transit area, while in section (12) separate evaporating devices for the three metals are foreseen. Particularly, a resistive bar is foreseen for melting silver, copper or their alloys, a radiation furnace for zinc and a heated cylindric bar for aluminium or aluminium alloys.
申请公布号 US4903165(A) 申请公布日期 1990.02.20
申请号 US19890334954 申请日期 1989.03.24
申请人 METALVUOTO FILMS S.P.A. 发明人 RONCHI, PIETRO
分类号 C23C14/14;C23C14/20;C23C14/24;C23C14/56;H01G;H01G4/008;H01G4/015;H01G4/18 主分类号 C23C14/14
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