| 摘要 |
<p>PURPOSE:To reduce the size of a semiconductor device by a method wherein a rectangular semiconductor chip or the like having a plurality of bonding pads on its center part is employed. CONSTITUTION:Bonding pads P7-P14 are provided on the part near the center of a semiconductor chip 1. After the surface of the semiconductor chip 1 on which the pads are formed is bonded and fixed to the rear of the leads of a lead frame by insulating adhesive 4 with an organic insulating film between, tip surfaces of inner leads provided on the surface side of the chip and the bonding pad parts are connected to each other by wire bonding and sealed with molding resin. Therefore, the leads do not protrude from the semiconductor chip. With this constitution, the size of a semiconductor device can be reduced corresponding to the extent of the protruding leads.</p> |
